IFP Component - OPS Module
OPS Module - OPS-i730
OPS module is an open pluggable module designed for IFP, all aluminum integrated heat dissipation, body surface groove surface wide design heat dissipation better, containing double copper tube, double radiator, its main advantages are flexibility and scalability, lightweight chassis and high-performance configuration, providing a comprehensive solution, suitable for educational institutions, enterprises and other different fields of use.
Features
·Maximum support for 6 X 3.0USB
·Low CPU temperature and strong performance
·30-42 Chassis Thickness/Japan Imported JAE Plug 4K 60HZ
·Type-C interface
·Achieve a thickness of 30MM
·Anti-fouling, dust-proof, fully enclosed body, preventing dust
·Normal operation at minus 15°-75°
·On-board WiFi, 2-in-1 audio
·Strong anti-static (static cloth and cotton to prevent short circuit of OPS caused by static electricity)
